Title:
Enhanced Electrical Properties of Anisotropic Conductive Adhesive With $pi$ -Conjugated Self-Assembled Molecular Wire Junctions

dc.contributor.author Zhang, Rongwei
dc.contributor.author Li, Yi
dc.contributor.author Yim, Myung Jin
dc.contributor.author Moon, Kyoung-Sik
dc.contributor.author Lu, Daoqiang
dc.contributor.author Wong, C. P.
dc.contributor.corporatename Georgia Institute of Technology. School of Materials Science and Engineering
dc.date.accessioned 2009-10-20T17:37:16Z
dc.date.available 2009-10-20T17:37:16Z
dc.date.issued 2009-09
dc.description © 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. en
dc.description DOI: 10.1109/TCAPT.2009.2012720
dc.description.abstract We have investigated the electrical properties of anisotropic conductive adhesive (ACA) joint using submicrometer- sized ( 500 nm in diameter) silver (Ag) particle as conductive filler with the effect of -conjugated self-assembled molecular wires. The ACAs with submicrometer-sized Ag particles have higher current carrying capability ( 3400 mA) than those with micro-sized Au-coated polymer particles ( 2000 mA) and Ag nanoparticles ( 2500 mA). More importantly, by construction of -conjugated self-assembled molecular wire junctions between conductive particles and integrated circuit (IC)/substrate, the electrical conductivity has increased by one order of magnitude and the current carrying capability of ACAs has improved by 600 mA. The crucial factors that govern the improved electrical properties are discussed based on the study of alignments and thermal stability of molecules on the submicrometer-sized Ag particle surface with surface-enhanced Raman spectroscopy (SERS), providing a fundamental understanding of conduction mechanism in ACA joints and guidelines for the formulation of high-performance ACAs in electronic packaging industry. en
dc.identifier.citation Wong, C.P.; Rongwei Zhang; Kyoung Sik Moon; Lu, D.D.; Yi Li; Myung Jin Yim, "Enhanced Electrical Properties of Anisotropic Conductive Adhesive With $pi$ -Conjugated Self-Assembled Molecular Wire Junctions," IEEE Transactions on Components and Packaging Technologies, Vol. 32, No. 3, September 2009, 677-683 en
dc.identifier.issn 1521-3331
dc.identifier.uri http://hdl.handle.net/1853/30602
dc.language.iso en_US en
dc.publisher Georgia Institute of Technology en
dc.publisher.original Institute of Electrical and Electronics Engineers, Inc., New York
dc.subject Adhesives en
dc.subject Electrical conductivity en
dc.subject Nanoparticles en
dc.subject Self-assembly en
dc.subject Silver en
dc.subject Surface enhanced Raman scattering en
dc.title Enhanced Electrical Properties of Anisotropic Conductive Adhesive With $pi$ -Conjugated Self-Assembled Molecular Wire Junctions en
dc.type Text
dc.type.genre Article
dspace.entity.type Publication
local.contributor.author Wong, C. P.
local.contributor.corporatename School of Materials Science and Engineering
local.contributor.corporatename College of Engineering
relation.isAuthorOfPublication 76540daf-1e96-4626-9ec1-bc8ed1f88e0a
relation.isOrgUnitOfPublication 21b5a45b-0b8a-4b69-a36b-6556f8426a35
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
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