Title:
Cohesive zone modeling for predicting interfacial delamination in microelectronic packaging

dc.contributor.advisor Sitaraman, Suresh K.
dc.contributor.author Krieger, William E. R.
dc.contributor.committeeMember Kalaitzidou, Kyriaki
dc.contributor.committeeMember Xia, Shuman
dc.contributor.committeeMember Hauck, Torsten
dc.contributor.department Mechanical Engineering
dc.date.accessioned 2014-05-22T15:33:22Z
dc.date.available 2014-05-22T15:33:22Z
dc.date.created 2014-05
dc.date.issued 2014-04-04
dc.date.submitted May 2014
dc.date.updated 2014-05-22T15:33:22Z
dc.description.abstract Multi-layered electronic packages increase in complexity with demands for functionality. Interfacial delamination remains a prominent failure mechanism due to mismatch of coefficient of thermal expansion (CTE). Numerous studies have investigated interfacial cracking in microelectronic packages using fracture mechanics, which requires knowledge of starter crack locations and crack propagation paths. Cohesive zone theory has been identified as an alternative method for modeling crack propagation and delamination without the need for a pre-existing crack. In a cohesive zone approach, traction forces between surfaces are related to the crack tip opening displacement and are governed by a traction-separation law. Unlike traditional fracture mechanics approaches, cohesive zone analyses can predict starter crack locations and directions or simulate complex geometries with more than one type of interface. In a cohesive zone model, cohesive zone elements are placed along material interfaces. Parameters that define cohesive zone behavior must be experimentally determined to be able to predict delamination propagation in a microelectronic package. The objective of this work is to study delamination propagation in a copper/mold compound interface through cohesive zone modeling. Mold compound and copper samples are fabricated, and such samples are used in experiments such as four-point bend test and double cantilever beam test to obtain the cohesive zone model parameters for a range of mode mixity. The developed cohesive zone elements are then placed in a small-outline integrated circuit package model at the interface between an epoxy mold compound and a copper lead frame. The package is simulated to go through thermal profiles associated with the fabrication of the package, and the potential locations for delamination are determined. Design guidelines are developed to reduce mold compound/copper lead frame interfacial delamination.
dc.description.degree M.S.
dc.format.mimetype application/pdf
dc.identifier.uri http://hdl.handle.net/1853/51888
dc.language.iso en_US
dc.publisher Georgia Institute of Technology
dc.subject Interfacial delamination
dc.subject Cohesive zone modeling
dc.subject Finite element modeling
dc.subject Critical strain energy release rate
dc.subject Microelectronic packaging
dc.subject.lcsh Composite materials Delamination
dc.subject.lcsh Microelectronics Research
dc.subject.lcsh Microelectronics
dc.title Cohesive zone modeling for predicting interfacial delamination in microelectronic packaging
dc.type Text
dc.type.genre Thesis
dspace.entity.type Publication
local.contributor.advisor Sitaraman, Suresh K.
local.contributor.corporatename George W. Woodruff School of Mechanical Engineering
local.contributor.corporatename College of Engineering
relation.isAdvisorOfPublication 86701d63-9ca5-4060-89f8-aca6e0b267f6
relation.isOrgUnitOfPublication c01ff908-c25f-439b-bf10-a074ed886bb7
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
thesis.degree.level Masters
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