Title:
Study of Sn-Ag-Cu reliability through material microstructure evolution and laser moire interferometry

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dc.contributor.advisor Sitaraman, Suresh K.
dc.contributor.author Tunga, Krishna Rajaram en_US
dc.contributor.department Mechanical Engineering en_US
dc.date.accessioned 2008-09-17T19:53:18Z
dc.date.available 2008-09-17T19:53:18Z
dc.date.issued 2008-07-08 en_US
dc.description.abstract This research aims to understand the reliability of Sn-Ag-Cu solder interconnects used in plastic ball grid array (PBGA) packages using microstructure evolution, laser moiré interferometry and finite-element modeling. A particle coarsening based microstructure evolution of the solder joint material during thermal excursions was studied for extended periods of time lasting for several months. The microstructure evolution and particle coarsening was quantified, and acceleration factors were determined between benign field-use conditions and accelerated thermal cycling (ATC) conditions for PBGA packages with different form factors and for two different lead-free solder alloys. A new technique using laser moiré interferometry was developed to assess the deformation behavior of Sn-Ag-Cu based solder joints during thermal excursions. This technique can used to estimate the fatigue life of solder joints quickly in a matter of few days instead of months and can be extended to cover a wide range of temperature regimes. Finite-element analysis (FEA) in conjunction with experimental data from the ATC for different lead-free PBGA packages was used to develop a fatigue life model that can be used to predict solder joint fatigue life for any PBGA package. The proposed model will be able to predict the mean number of cycles required for crack initiation and crack growth rate in a solder joint. en_US
dc.description.degree Ph.D. en_US
dc.identifier.uri http://hdl.handle.net/1853/24805
dc.publisher Georgia Institute of Technology en_US
dc.subject Fatigue life prediction en_US
dc.subject Solder joint fatigue en_US
dc.subject Microstructure evolution en_US
dc.subject SAC405 en_US
dc.subject SAC305 en_US
dc.subject Laser moire interferometry en_US
dc.subject Finite element modeling en_US
dc.subject Lead-free solders en_US
dc.subject.lcsh Moiré method
dc.subject.lcsh Ball grid array technology
dc.subject.lcsh Electronic packaging
dc.title Study of Sn-Ag-Cu reliability through material microstructure evolution and laser moire interferometry en_US
dc.type Text
dc.type.genre Dissertation
dspace.entity.type Publication
local.contributor.advisor Sitaraman, Suresh K.
local.contributor.corporatename George W. Woodruff School of Mechanical Engineering
local.contributor.corporatename College of Engineering
relation.isAdvisorOfPublication 86701d63-9ca5-4060-89f8-aca6e0b267f6
relation.isOrgUnitOfPublication c01ff908-c25f-439b-bf10-a074ed886bb7
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
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