Title:
Microstructural configuration influence on electromigration in Sn/Cu thin films
Microstructural configuration influence on electromigration in Sn/Cu thin films
| dc.contributor.advisor | Conrad, Edward H. | |
| dc.contributor.author | Xu, Yi | en_US |
| dc.contributor.department | Physics | en_US |
| dc.date.accessioned | 2009-10-29T20:29:02Z | |
| dc.date.available | 2009-10-29T20:29:02Z | |
| dc.date.issued | 1994-12 | en_US |
| dc.description.degree | Ph.D. | en_US |
| dc.identifier.other | 402024 | en_US |
| dc.identifier.uri | http://hdl.handle.net/1853/31039 | |
| dc.publisher | Georgia Institute of Technology | en_US |
| dc.subject.lcsh | Electrodiffusion | en_US |
| dc.subject.lcsh | Thin films | en_US |
| dc.title | Microstructural configuration influence on electromigration in Sn/Cu thin films | en_US |
| dc.type | Text | |
| dc.type.genre | Dissertation | |
| dspace.entity.type | Publication | |
| local.contributor.corporatename | College of Sciences | |
| local.contributor.corporatename | School of Physics | |
| relation.isOrgUnitOfPublication | 85042be6-2d68-4e07-b384-e1f908fae48a | |
| relation.isOrgUnitOfPublication | 2ba39017-11f1-40f4-9bc5-66f17b8f1539 |
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