Title:
Toward real-time estimation of surface evolution in plasma etching: isotropy, anisotropy, and self-calibration
Toward real-time estimation of surface evolution in plasma etching: isotropy, anisotropy, and self-calibration
| dc.contributor.author | Berg, Jordan M. | en_US |
| dc.contributor.author | Yezzi, Anthony | en_US |
| dc.contributor.author | Tannenbaum, Allen R. | en_US |
| dc.contributor.corporatename | Texas Tech University. Dept. of Mechanical Engineering | en_US |
| dc.contributor.corporatename | University of Minnesota. Dept. of Electrical Engineering | en_US |
| dc.date.accessioned | 2010-04-13T19:45:22Z | en_US |
| dc.date.available | 2010-04-13T19:45:22Z | en_US |
| dc.date.issued | 1997-12 | |
| dc.description | ©1997 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. | en_US |
| dc.description | Presented at the 36th IEEE Conference on Decision and Control : December 10-12, 1997, Hyatt Regency San Diego, San Diego, CA, USA. | en_US |
| dc.description | DOI: 10.1109/CDC.1997.650750 | en_US |
| dc.description.abstract | Level set methods are proving to be an effective tool for simulating surface evolution during chip manufacturing processes such as etching, deposition, and lithographic development. These methods can be implemented using extremely fast and robust algorithms, making them ideal for real-time model-based control applications. An approach for isotropic etching is developed and demonstrated in simulation. Modifcations necessary to address certain anisotropic processes and self-calibration of the estimator are sketched. | en_US |
| dc.identifier.citation | Jordan M. Berg, Anthony Yezzi and Allen Tannenbaum, Toward real-time estimation of surface evolution in plasma etching: isotropy, anisotropy, and self-calibration, Proceedings of 36th IEEE Conference on Decision and Control, December 1997, 860-865. | en_US |
| dc.identifier.isbn | 0-7803-4187-2 | |
| dc.identifier.uri | http://hdl.handle.net/1853/32525 | |
| dc.language.iso | en_US | en_US |
| dc.publisher | Georgia Institute of Technology | en_US |
| dc.publisher.original | Institute of Electrical and Electronics Engineers | en_US |
| dc.subject | Parameter estimation | en_US |
| dc.subject | Process control | en_US |
| dc.subject | Integrated circuit manufacture | en_US |
| dc.subject | Real-time systems | en_US |
| dc.subject | Sputter etching | en_US |
| dc.subject | Calibration | en_US |
| dc.title | Toward real-time estimation of surface evolution in plasma etching: isotropy, anisotropy, and self-calibration | en_US |
| dc.type | Text | |
| dc.type.genre | Proceedings | |
| dspace.entity.type | Publication | |
| local.contributor.author | Yezzi, Anthony | |
| local.contributor.corporatename | School of Electrical and Computer Engineering | |
| local.contributor.corporatename | College of Engineering | |
| local.contributor.corporatename | Wallace H. Coulter Department of Biomedical Engineering | |
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