Title:
Application of internal state variable models to thermal processing and reliability of plated through holes in printed wiring boards
Application of internal state variable models to thermal processing and reliability of plated through holes in printed wiring boards
dc.contributor.advisor | Ume, I. Charles | |
dc.contributor.author | Fu, Chia-Yu | en_US |
dc.contributor.department | Mechanical engineering | en_US |
dc.date.accessioned | 2007-11-08T12:36:21Z | |
dc.date.available | 2007-11-08T12:36:21Z | |
dc.date.issued | 1999-08 | en_US |
dc.description.degree | Ph.D. | en_US |
dc.identifier.bibid | 493864 | en_US |
dc.identifier.uri | http://hdl.handle.net/1853/17375 | |
dc.publisher | Georgia Institute of Technology | en_US |
dc.rights | Access restricted to authorized Georgia Tech users only. | en_US |
dc.subject.lcsh | Printed circuits Testing | en_US |
dc.subject.lcsh | Semiconductors Thermal properties | en_US |
dc.title | Application of internal state variable models to thermal processing and reliability of plated through holes in printed wiring boards | en_US |
dc.type | Text | |
dc.type.genre | Dissertation | |
dspace.entity.type | Publication | |
local.contributor.corporatename | George W. Woodruff School of Mechanical Engineering | |
local.contributor.corporatename | College of Engineering | |
relation.isOrgUnitOfPublication | c01ff908-c25f-439b-bf10-a074ed886bb7 | |
relation.isOrgUnitOfPublication | 7c022d60-21d5-497c-b552-95e489a06569 |
Files
Original bundle
1 - 1 of 1
No Thumbnail Available
- Name:
- fu_chia-yu_199908_phd_493864.pdf
- Size:
- 12.9 MB
- Format:
- Adobe Portable Document Format
- Description: