Title:
Application of internal state variable models to thermal processing and reliability of plated through holes in printed wiring boards

Thumbnail Image
Author(s)
Fu, Chia-Yu
Authors
Advisor(s)
Ume, I. Charles
Advisor(s)
Editor(s)
Associated Organization(s)
Series
Supplementary to
Abstract
Sponsor
Date Issued
1999-08
Extent
Resource Type
Text
Resource Subtype
Dissertation
Rights Statement
Access restricted to authorized Georgia Tech users only.
Rights URI