Title:
Application of internal state variable models to thermal processing and reliability of plated through holes in printed wiring boards
Application of internal state variable models to thermal processing and reliability of plated through holes in printed wiring boards
Author(s)
Fu, Chia-Yu
Advisor(s)
Ume, I. Charles
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Abstract
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Date Issued
1999-08
Extent
Resource Type
Text
Resource Subtype
Dissertation
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Access restricted to authorized Georgia Tech users only.