Title:
Flip chip assembly process development, process characterization, and reliability assessment of polymer stud grid array-chip scaled package
Flip chip assembly process development, process characterization, and reliability assessment of polymer stud grid array-chip scaled package
Author(s)
Paydenkar, Chetan S.
Advisor(s)
Baldwin, Daniel F.
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Date Issued
2001-05
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Text
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Thesis
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