Title:
Stress Relieving Second Level Interconnect Structures And Methods Of Making The Same
Stress Relieving Second Level Interconnect Structures And Methods Of Making The Same
Files
Author(s)
Advisor(s)
Editor(s)
Collections
Supplementary to
Permanent Link
Abstract
Provided is a stress-relieving, second-level interconnect structure that is low-cost and accommodates thermal coefficient of expansion (TCE) mismatch between low-TCE packages and printed circuit boards (PCBs). The interconnect structure comprises at least a first pad, a supporting pillar, and a solder bump, wherein the first pad and supporting pillar are operative to absorb substantially all plastic strain, thereby enhancing compliance between the two electronic components.
Sponsor
Date Issued
3/3/2015
Extent
Resource Type
Text
Resource Subtype
Patent