Title:
Thermal cycling and rate-dependent stress relaxation behavior of solders
Thermal cycling and rate-dependent stress relaxation behavior of solders
dc.contributor.advisor | Neu, Richard W. | |
dc.contributor.author | Woodmansee, Michael W. | en_US |
dc.contributor.department | Mechanical engineering | en_US |
dc.date.accessioned | 2007-11-08T12:34:29Z | |
dc.date.available | 2007-11-08T12:34:29Z | |
dc.date.issued | 1999-08 | en_US |
dc.description.degree | M.S. | en_US |
dc.identifier.bibid | 496285 | en_US |
dc.identifier.uri | http://hdl.handle.net/1853/17301 | |
dc.publisher | Georgia Institute of Technology | en_US |
dc.rights | Access restricted to authorized Georgia Tech users only. | en_US |
dc.subject.lcsh | Deformations (Mechanics) | en_US |
dc.subject.lcsh | Solder and soldering Testing | en_US |
dc.subject.lcsh | Materials Mechanical properties | en_US |
dc.title | Thermal cycling and rate-dependent stress relaxation behavior of solders | en_US |
dc.type | Text | |
dc.type.genre | Thesis | |
dspace.entity.type | Publication | |
local.contributor.advisor | Neu, Richard W. | |
local.contributor.corporatename | George W. Woodruff School of Mechanical Engineering | |
local.contributor.corporatename | College of Engineering | |
relation.isAdvisorOfPublication | 06a1818c-da22-4133-bde7-ad5adc26dab7 | |
relation.isOrgUnitOfPublication | c01ff908-c25f-439b-bf10-a074ed886bb7 | |
relation.isOrgUnitOfPublication | 7c022d60-21d5-497c-b552-95e489a06569 |
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