Title:
Use of Compliant Adhesives in the Large Area Processing of MCM-D Substrates
Use of Compliant Adhesives in the Large Area Processing of MCM-D Substrates
| dc.contributor.author | Wong, C. P. | |
| dc.contributor.author | Wu, Jiali | |
| dc.contributor.author | Pike, Randy T. | |
| dc.date.accessioned | 2006-08-29T19:13:28Z | |
| dc.date.available | 2006-08-29T19:13:28Z | |
| dc.date.issued | 1998-10 | |
| dc.description | ©1998 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. | en |
| dc.description.abstract | Large area substrate processing is a key solution for improving the productivity of multichip module deposition (MCM-D) technology. This project is focused on high temperature polymeric adhesives for attachment of silicon tiles to suitable pallets to facilitate large area film processing of MCM structures. Current polymeric high temperature adhesives are predominately polyimide-based that are not reworkable, which places an obstacle to remove the coated substrates and to reuse the high cost pallets. However, an approach will be presented in this paper to address this demand by introducing thermally cleavable links in the thermoset polyimide-amide resin. A series of novel reworkable high temperature (in excess of 350–400 ℃) adhesives have been developed, that can meet the requirements of adhesion, viscosity, thermal stability, and reworkability of the MCM-D production. Furthermore, scanning electron microscopy (SEM) microstructure images are presented for intuitive reworkability analysis. | en |
| dc.format.extent | 345691 bytes | |
| dc.format.mimetype | application/pdf | |
| dc.identifier.citation | IEEE transactions on components, packaging, and manufacturing technology. Part C, Manufacturing, Vol. 21, no. 4, October 1998, 311-316 | en |
| dc.identifier.uri | http://hdl.handle.net/1853/11443 | |
| dc.language.iso | en_US | en |
| dc.publisher | Georgia Institute of Technology | en |
| dc.publisher.original | Institute of Electrical and Electronics Engineers, Inc., New York | |
| dc.subject | Adhesion | en |
| dc.subject | Multichip module deposition (MCMD) | en |
| dc.subject | Polyimide-amide-epoxy | en |
| dc.subject | Reworkability | en |
| dc.subject | Thermal stability | en |
| dc.subject | Thermally cleavable links | en |
| dc.title | Use of Compliant Adhesives in the Large Area Processing of MCM-D Substrates | en |
| dc.type | Text | |
| dc.type.genre | Article | |
| dspace.entity.type | Publication | |
| local.contributor.author | Wong, C. P. | |
| local.contributor.corporatename | School of Materials Science and Engineering | |
| local.contributor.corporatename | College of Engineering | |
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