Title:
ELECTRONIC DESIGN AUTOMATION TOOLS AND DESIGN STUDY FOR HETEROGENEOUS MONOLITHIC 3D INTEGRATED CIRCUITS

dc.contributor.advisor Lim, Sung Kyu
dc.contributor.author Pentapati, Sai Surya Kiran
dc.contributor.committeeMember Yu, Shimeng
dc.contributor.committeeMember Mukhopadhyay, Saibal
dc.contributor.committeeMember Hao, Callie
dc.contributor.committeeMember Kim, Hyesoon
dc.contributor.department Electrical and Computer Engineering
dc.date.accessioned 2022-05-18T19:32:13Z
dc.date.available 2022-05-18T19:32:13Z
dc.date.created 2022-05
dc.date.issued 2022-04-13
dc.date.submitted May 2022
dc.date.updated 2022-05-18T19:32:13Z
dc.description.abstract Technology scaling predicted by Moore's law is gradually slowing down and new alternatives to silicon-based transistors are being explored. Some of the most promising solutions make use of materials such as carbon nanotubes or ferroelectric layers in the gate stack. While such materials bring improvements to the transistor performance, Three Dimensional (3D) Integrated Circuit (IC) Design, which is the focus of this work, is another promising alternative for going beyond Moore’s Law. 3D IC provides power, performance, and area (PPA) benefits at full-chip level, orthogonal to the transistor improvements by stacking multiple smaller 2D dies vertically instead of using a single large 2D die. The objective of this research is to explore and exploit novel design configurations possible with 3D ICs. Furthermore, tool flows and algorithms were developed to augment and capitalize on the commercially available 2D Electronic Design Automation (EDA) tools to support our exploration. While most of the work is done based on assumptions related to the state-of-the-art research fabrication methods for 3D such as Monolithic 3D ICs, we also develop new flows to refine the 3D IC routing with commercially available fabrication techniques such as hybrid bonding and micro-bump based 3D ICs.
dc.description.degree Ph.D.
dc.format.mimetype application/pdf
dc.identifier.uri http://hdl.handle.net/1853/66554
dc.language.iso en_US
dc.publisher Georgia Institute of Technology
dc.subject 3D Integrated Circuits
dc.subject Electronic Design Automation Tools
dc.subject Heterogeneous Circuits
dc.title ELECTRONIC DESIGN AUTOMATION TOOLS AND DESIGN STUDY FOR HETEROGENEOUS MONOLITHIC 3D INTEGRATED CIRCUITS
dc.type Text
dc.type.genre Dissertation
dspace.entity.type Publication
local.contributor.advisor Lim, Sung Kyu
local.contributor.corporatename School of Electrical and Computer Engineering
local.contributor.corporatename College of Engineering
relation.isAdvisorOfPublication 31bc3e86-9942-4b3f-aeae-783bb95052ff
relation.isOrgUnitOfPublication 5b7adef2-447c-4270-b9fc-846bd76f80f2
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
thesis.degree.level Doctoral
Files
Original bundle
Now showing 1 - 1 of 1
Thumbnail Image
Name:
PENTAPATI-DISSERTATION-2022.pdf
Size:
55.42 MB
Format:
Adobe Portable Document Format
Description:
License bundle
Now showing 1 - 1 of 1
No Thumbnail Available
Name:
LICENSE.txt
Size:
3.88 KB
Format:
Plain Text
Description: