Title:
Multi-layer Finite Element Method For Modeling Of Package Power And Ground Planes

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dc.contributor.patentcreator Bharath, Krishna
dc.contributor.patentcreator Swaminathan, Madhavan
dc.date.accessioned 2017-05-12T14:29:17Z
dc.date.available 2017-05-12T14:29:17Z
dc.date.filed 2/23/2010
dc.date.issued 7/10/2012
dc.description.abstract In a method for simulating electrical characteristics of a plurality of power planes, each power plane includes a plurality of geometric features. The geometric features of each power plane are projected onto a single planar construct. A polygonal mesh, including a plurality of pairs of interconnected nodes, that corresponds to the single planar construct is generated. The polygonal mesh is projected onto at least one power plane an equivalent circuit between each adjacent node of the plurality of interconnected nodes is projected onto the power plane. An equivalent capacitance is assigned between each node and a common ground planer. A finite element equation that includes a plurality of discrete terms is generated. The equation is solved, thereby determining the electrical characteristic value between each pair of adjacent nodes.
dc.description.assignee Georgia Tech Research Corporation
dc.identifier.cpc G06F17/5018
dc.identifier.cpc G06F17/5036
dc.identifier.cpc G06F2217/40
dc.identifier.patentapplicationnumber 12/710991
dc.identifier.patentnumber 8219377
dc.identifier.uri http://hdl.handle.net/1853/58059
dc.identifier.uspc 703/14
dc.title Multi-layer Finite Element Method For Modeling Of Package Power And Ground Planes
dc.type Text
dc.type.genre Patent
dspace.entity.type Publication
local.contributor.corporatename Georgia Institute of Technology
local.relation.ispartofseries Georgia Tech Patents
relation.isOrgUnitOfPublication cc30e153-7a64-4ae2-9b1d-5436686785e3
relation.isSeriesOfPublication 0f49c79d-4efb-4bd9-b060-5c7f9191b9da
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