Title:
Thin-film trench capacitors for silicon and organic packages

dc.contributor.advisor Tummala, Rao R.
dc.contributor.author Wang, Yushu en_US
dc.contributor.committeeMember Gerhardt, Rosario
dc.contributor.committeeMember Raj, Pulugurtha Markondeya
dc.contributor.department Materials Science and Engineering en_US
dc.date.accessioned 2012-02-17T19:18:27Z
dc.date.available 2012-02-17T19:18:27Z
dc.date.issued 2011-08-29 en_US
dc.description Thesis advisor has approved the addition of errata to this item. The abstract text in the metadata record has been modified to match the document text.
dc.description.abstract The continuous trend towards mega-functional, high-performance and ultra-miniaturized system has been driving the need for advances in novel materials with superior properties leading to thin components, high-density interconnect substrates and interconnections. Power supply and management is becoming a critical bottleneck for the advances in such mega-functional systems because power components do not scale down with the rest of the system resulting in bulky and stand-alone power modules. Amongst the power components, thin film capacitors are considered the most challenging to integrate because of several manufacturability concerns. The challenges are related to process compatibility of high permittivity dielectrics with substrates and high surface area electrodes, yield, leakage and losses. This thesis focuses on novel thin film capacitor technologies that address some of these critical challenges. en_US
dc.description.degree MS en_US
dc.identifier.uri http://hdl.handle.net/1853/42741
dc.publisher Georgia Institute of Technology en_US
dc.subject Electrolytic capacitors en_US
dc.subject TSV en_US
dc.subject Sol-gel en_US
dc.subject High density en_US
dc.subject Low ESR electrode en_US
dc.subject.lcsh Electrolytic capacitors
dc.subject.lcsh Thin film devices
dc.title Thin-film trench capacitors for silicon and organic packages en_US
dc.type Text
dc.type.genre Thesis
dspace.entity.type Publication
local.contributor.advisor Tummala, Rao R.
local.contributor.corporatename School of Materials Science and Engineering
local.contributor.corporatename College of Engineering
relation.isAdvisorOfPublication fe05ddb2-e957-4584-ac88-58a197df62aa
relation.isOrgUnitOfPublication 21b5a45b-0b8a-4b69-a36b-6556f8426a35
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
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