Title:
Novel conductive adhesives for electronic packaging applications: a way towards economical, highly conductive, low temperature and flexible interconnects

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dc.contributor.advisor Wong, C. P.
dc.contributor.author Zhang, Rongwei en_US
dc.contributor.committeeMember Bredas, Jean-Luc
dc.contributor.committeeMember Collard, David M.
dc.contributor.committeeMember Perry, Joseph
dc.contributor.committeeMember Zhang, Z. John
dc.contributor.department Chemistry and Biochemistry en_US
dc.date.accessioned 2011-07-06T16:46:39Z
dc.date.available 2011-07-06T16:46:39Z
dc.date.issued 2011-03-29 en_US
dc.description.abstract Isotropically conductive adhesives (ICAs) are promising as a lead-free interconnect material; However, ICAs have a higher resistivity compared to tin/lead solder. The higher resistivity of ICAs results from the large contact resistance between conductive fillers. Several novel approaches to engineer the interface between electrically conductive fillers were studied to develop highly conductive ICAs. Shown in this dissertation are three methodologies to reduce contact resistance: low temperature sintering, fast sintering and in-situ reduction. Furthermore, two approaches, surface modification and in-situ protection, were developed to prevent oxidation and corrosion of silver-coated copper flakes to produce low cost ICAs. The findings and insights in this dissertation significantly contribute to (1) understanding of filler-filler, filler-polymer and structure-property relationships of ICAs; (2) the structural design and formulation of high performance ICAs; and (3) the wider use of ICAs in emerging applications such as printed electronics and solar cells. en_US
dc.description.degree Ph.D. en_US
dc.identifier.uri http://hdl.handle.net/1853/39548
dc.publisher Georgia Institute of Technology en_US
dc.subject Reliability en_US
dc.subject Interface en_US
dc.subject Coupling agent en_US
dc.subject Corrosion en_US
dc.subject Conductivity mechanism en_US
dc.subject Adhesion en_US
dc.subject Epoxy en_US
dc.subject Sintering en_US
dc.subject Conductive polymer composites en_US
dc.subject.lcsh Interconnects (Integrated circuit technology)
dc.subject.lcsh Adhesives Electric properties
dc.title Novel conductive adhesives for electronic packaging applications: a way towards economical, highly conductive, low temperature and flexible interconnects en_US
dc.type Text
dc.type.genre Dissertation
dspace.entity.type Publication
local.contributor.advisor Wong, C. P.
local.contributor.corporatename School of Chemistry and Biochemistry
local.contributor.corporatename College of Sciences
relation.isAdvisorOfPublication 76540daf-1e96-4626-9ec1-bc8ed1f88e0a
relation.isOrgUnitOfPublication f1725b93-3ab8-4c47-a4c3-3596c03d6f1e
relation.isOrgUnitOfPublication 85042be6-2d68-4e07-b384-e1f908fae48a
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