Title:
Study on thermally reworkable underfills for flip chip, BGA, and CSP applications
Study on thermally reworkable underfills for flip chip, BGA, and CSP applications
dc.contributor.advisor | Wong, C. P. | |
dc.contributor.author | Wang, Lejun | en_US |
dc.contributor.department | Materials Science and Engineering | en_US |
dc.date.accessioned | 2008-01-17T12:32:35Z | |
dc.date.available | 2008-01-17T12:32:35Z | |
dc.date.issued | 2001-05 | en_US |
dc.description.degree | Ph.D. | en_US |
dc.identifier.bibid | 608077 | en_US |
dc.identifier.uri | http://hdl.handle.net/1853/19011 | |
dc.publisher | Georgia Institute of Technology | en_US |
dc.rights | Access restricted to authorized Georgia Tech users only. | en_US |
dc.subject.lcsh | Integrated circuits | en_US |
dc.subject.lcsh | Electronic packaging | en_US |
dc.title | Study on thermally reworkable underfills for flip chip, BGA, and CSP applications | en_US |
dc.type | Text | |
dc.type.genre | Dissertation | |
dspace.entity.type | Publication | |
local.contributor.advisor | Wong, C. P. | |
local.contributor.corporatename | School of Materials Science and Engineering | |
local.contributor.corporatename | College of Engineering | |
relation.isAdvisorOfPublication | 76540daf-1e96-4626-9ec1-bc8ed1f88e0a | |
relation.isOrgUnitOfPublication | 21b5a45b-0b8a-4b69-a36b-6556f8426a35 | |
relation.isOrgUnitOfPublication | 7c022d60-21d5-497c-b552-95e489a06569 |
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