Title:
Study on thermally reworkable underfills for flip chip, BGA, and CSP applications

dc.contributor.advisor Wong, C. P.
dc.contributor.author Wang, Lejun en_US
dc.contributor.department Materials Science and Engineering en_US
dc.date.accessioned 2008-01-17T12:32:35Z
dc.date.available 2008-01-17T12:32:35Z
dc.date.issued 2001-05 en_US
dc.description.degree Ph.D. en_US
dc.identifier.bibid 608077 en_US
dc.identifier.uri http://hdl.handle.net/1853/19011
dc.publisher Georgia Institute of Technology en_US
dc.rights Access restricted to authorized Georgia Tech users only. en_US
dc.subject.lcsh Integrated circuits en_US
dc.subject.lcsh Electronic packaging en_US
dc.title Study on thermally reworkable underfills for flip chip, BGA, and CSP applications en_US
dc.type Text
dc.type.genre Dissertation
dspace.entity.type Publication
local.contributor.advisor Wong, C. P.
local.contributor.corporatename School of Materials Science and Engineering
local.contributor.corporatename College of Engineering
relation.isAdvisorOfPublication 76540daf-1e96-4626-9ec1-bc8ed1f88e0a
relation.isOrgUnitOfPublication 21b5a45b-0b8a-4b69-a36b-6556f8426a35
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
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