Title:
Study on thermally reworkable underfills for flip chip, BGA, and CSP applications
Study on thermally reworkable underfills for flip chip, BGA, and CSP applications
Authors
Wang, Lejun
Authors
Advisors
Wong, C. P.
Advisors
Person
Associated Organizations
Organizational Unit
Organizational Unit
Series
Collections
Supplementary to
Permanent Link
Abstract
Sponsor
Date Issued
2001-05
Extent
Resource Type
Text
Resource Subtype
Dissertation
Rights Statement
Access restricted to authorized Georgia Tech users only.