Title:
Study on thermally reworkable underfills for flip chip, BGA, and CSP applications
Study on thermally reworkable underfills for flip chip, BGA, and CSP applications
Author(s)
Wang, Lejun
Advisor(s)
Wong, C. P.
Editor(s)
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Abstract
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Date Issued
2001-05
Extent
Resource Type
Text
Resource Subtype
Dissertation
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Access restricted to authorized Georgia Tech users only.