Title:
Wideband characterization of wire bond interconnects for microwave integrated circuit packaging
Wideband characterization of wire bond interconnects for microwave integrated circuit packaging
Authors
Sutono, Albert
Authors
Advisors
Laskar, Joy
Advisors
Associated Organizations
Organizational Unit
Organizational Unit
Series
Collections
Supplementary to
Permanent Link
Abstract
Sponsor
Date Issued
1999-05
Extent
237 bytes
Resource Type
Text
Resource Subtype
Thesis
Rights Statement
Access restricted to authorized Georgia Tech users only.