Title:
Wideband characterization of wire bond interconnects for microwave integrated circuit packaging
Wideband characterization of wire bond interconnects for microwave integrated circuit packaging
Author(s)
Sutono, Albert
Advisor(s)
Laskar, Joy
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Abstract
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Date Issued
1999-05
Extent
237 bytes
Resource Type
Text
Resource Subtype
Thesis
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Access restricted to authorized Georgia Tech users only.