Title:
Wideband characterization of wire bond interconnects for microwave integrated circuit packaging

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sutono_albert_199905_ms_496355.pdf (6.58 MB)
Author(s)
Sutono, Albert
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Advisor(s)
Laskar, Joy
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Theses and Dissertations
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http://hdl.handle.net/1853/13375
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Date Issued
1999-05
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237 bytes
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Text
Resource Subtype
Thesis
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