Title:
High throughput flip chip assembly process application and assessment using no-flow underfill materials
High throughput flip chip assembly process application and assessment using no-flow underfill materials
| dc.contributor.advisor | Baldwin, Daniel F. | |
| dc.contributor.author | Milner, David William | en_US |
| dc.contributor.department | Mechanical engineering | en_US |
| dc.date.accessioned | 2007-08-17T11:31:03Z | |
| dc.date.available | 2007-08-17T11:31:03Z | |
| dc.date.issued | 2001-05 | en_US |
| dc.description.degree | M.S. | en_US |
| dc.identifier.bibid | 607935 | en_US |
| dc.identifier.uri | http://hdl.handle.net/1853/16359 | |
| dc.publisher | Georgia Institute of Technology | en_US |
| dc.rights | Access restricted to authorized Georgia Tech users only. | en_US |
| dc.subject.lcsh | Electronic apparatus and appliances Packaging | en_US |
| dc.subject.lcsh | Integrated circuits | en_US |
| dc.title | High throughput flip chip assembly process application and assessment using no-flow underfill materials | en_US |
| dc.type | Text | |
| dc.type.genre | Thesis | |
| dspace.entity.type | Publication | |
| local.contributor.corporatename | George W. Woodruff School of Mechanical Engineering | |
| local.contributor.corporatename | College of Engineering | |
| relation.isOrgUnitOfPublication | c01ff908-c25f-439b-bf10-a074ed886bb7 | |
| relation.isOrgUnitOfPublication | 7c022d60-21d5-497c-b552-95e489a06569 |
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