Title:
Methodologies for modeling simultaneous switching noise in multi-layered packages and boards

dc.contributor.advisor Peterson, Andrew F.
dc.contributor.author Chun, Sungjun en_US
dc.contributor.department Electrical and computer engineering en_US
dc.date.accessioned 2007-07-06T11:30:49Z
dc.date.available 2007-07-06T11:30:49Z
dc.date.issued 2002-05 en_US
dc.description.degree Ph.D. en_US
dc.identifier.bibid 629151 en_US
dc.identifier.uri http://hdl.handle.net/1853/15452
dc.publisher Georgia Institute of Technology en_US
dc.rights Access restricted to authorized Georgia Tech users only. en_US
dc.subject.lcsh Electric circuits Noise en_US
dc.subject.lcsh Metal oxide semiconductors, Complementary Mathematical models en_US
dc.subject.lcsh Electronic packaging Design en_US
dc.title Methodologies for modeling simultaneous switching noise in multi-layered packages and boards en_US
dc.type Text
dc.type.genre Dissertation
dspace.entity.type Publication
local.contributor.advisor Peterson, Andrew F.
local.contributor.corporatename School of Electrical and Computer Engineering
local.contributor.corporatename College of Engineering
relation.isAdvisorOfPublication 080ab541-0779-41ab-ae29-90761a9f6649
relation.isOrgUnitOfPublication 5b7adef2-447c-4270-b9fc-846bd76f80f2
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
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