Title:
Interconnects, System Integration, and Packaging of Electronics
Interconnects, System Integration, and Packaging of Electronics
| dc.contributor.author | Bakir, Muhannad S. | |
| dc.contributor.corporatename | Georgia Institute of Technology. Institute for Electronics and Nanotechnology | en_US |
| dc.contributor.corporatename | Georgia Institute of Technology. School of Electrical and Computer Engineering | en_US |
| dc.contributor.corporatename | Georgia Institute of Technology. School of Materials Science and Engineering | en_US |
| dc.contributor.corporatename | Georgia Institute of Technology. Packaging Research Center | en_US |
| dc.date.accessioned | 2014-08-25T15:14:01Z | |
| dc.date.available | 2014-08-25T15:14:01Z | |
| dc.date.issued | 2014-08-21 | |
| dc.description | Presented on August 21, 2014 at 12:00 p.m. in the Marcus Nanotechnology Building Conference Room 1116. | en_US |
| dc.description | Muhannad S. Bakir received his B.E.E. degree (Summa Cum Laude) from Auburn University, Auburn, AL, in 1999 and his M.S. and Ph.D. degrees in electrical and computer engineering from the Georgia Institute of Technology in 2000 and 2003, respectively. Bakir is currently an Associate Professor and the ON Semiconductor Junior Professor in the School of Electrical and Computer Engineering at Georgia Tech. His areas of interest include three-dimensional (3D) electronic system integration, advanced cooling and power delivery for 3D systems, heterogeneous system interconnection, biosensors and their integration with CMOS circuitry, and nanofabrication technology. | en_US |
| dc.description | Runtime: 63:41 minutes | |
| dc.description.abstract | This presentation will provide a retrospect and prospects for electronics interconnects, system integration, and packaging. | en_US |
| dc.embargo.terms | null | en_US |
| dc.format.extent | 63:41 minutes | |
| dc.identifier.uri | http://hdl.handle.net/1853/52146 | |
| dc.relation.ispartof | IEN Technical Seminars | |
| dc.subject | Electronics packaging | en_US |
| dc.subject | Microelectro | en_US |
| dc.title | Interconnects, System Integration, and Packaging of Electronics | en_US |
| dc.type | Moving Image | |
| dc.type.genre | Presentation | |
| dspace.entity.type | Publication | |
| local.contributor.author | Bakir, Muhannad S. | |
| local.contributor.corporatename | Institute for Electronics and Nanotechnology (IEN) | |
| relation.isAuthorOfPublication | 752d9ed4-97ec-4a80-9920-4b4d3e762de1 | |
| relation.isOrgUnitOfPublication | 5d316582-08fe-42e1-82e3-9f3b79dd6dae |
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