Title:
Congestion-Driven Global Placement for Three Dimensional VLSI Circuits

dc.contributor.author Nanda, Vidit
dc.contributor.author Balakrishnan, Karthik
dc.contributor.author Ekpanyapong, Mongkol
dc.contributor.author Lim, Sung Kyu
dc.date.accessioned 2005-03-29T14:31:32Z
dc.date.available 2005-03-29T14:31:32Z
dc.date.issued 2003
dc.description.abstract The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wiring length. However, the problem of thermal dissipation is magnified due to the nature of these layered technologies. In this paper, we develop techniques to reduce both the local and global congestions of 3D circuit designs in order to alleviate thermal issues. Our approach consists of two phases. First, we use a multilevel min-cut based approach with a modified gain function in order to minimize the local congestion. Then, we perform simulated annealing to reduce the circuit's global congestion. Experimental results show that our local congestion is reduced by an average of over 44% and global congestion is reduced by over 16%. Moreover, we only see an 11% increase in the wiring length and the number of vias required. en
dc.format.extent 611077 bytes
dc.format.mimetype application/pdf
dc.identifier.uri http://hdl.handle.net/1853/5944
dc.language.iso en_US
dc.publisher Georgia Institute of Technology en
dc.relation.ispartofseries CERCS;GIT-CERCS-03-27
dc.subject 3D IC technology
dc.subject Gain function
dc.subject Global congestion of 3D circuit designs
dc.subject Local congestion of 3D circuit designs
dc.subject Mincut-based global placement
dc.subject Simulated annealing
dc.subject Thermal dissipation
dc.subject Wirelength
dc.subject Thermal issues
dc.title Congestion-Driven Global Placement for Three Dimensional VLSI Circuits en
dc.type Text
dc.type.genre Technical Report
dspace.entity.type Publication
local.contributor.author Lim, Sung Kyu
local.contributor.corporatename Center for Experimental Research in Computer Systems
local.relation.ispartofseries CERCS Technical Report Series
relation.isAuthorOfPublication 31bc3e86-9942-4b3f-aeae-783bb95052ff
relation.isOrgUnitOfPublication 1dd858c0-be27-47fd-873d-208407cf0794
relation.isSeriesOfPublication bc21f6b3-4b86-4b92-8b66-d65d59e12c54
Files
Original bundle
Now showing 1 - 1 of 1
Thumbnail Image
Name:
git-cercs-03-27.pdf
Size:
596.75 KB
Format:
Adobe Portable Document Format
Description:
License bundle
Now showing 1 - 1 of 1
No Thumbnail Available
Name:
license.txt
Size:
1.86 KB
Format:
Item-specific license agreed upon to submission
Description: