Bakir, Muhannad S.
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Item Interconnects, System Integration, and Packaging of Electronics(2014-08-21) Bakir, Muhannad S.Item 3D Integration: A New Era for the Integrated Circuit(Georgia Institute of Technology, 2010-03-30) Bakir, Muhannad S.Item Chip-level waveguide-mirror-pillar optical interconnect structure(Georgia Institute of Technology, 2006-07) Bakir, Muhannad S.; Ogunsola, O. O.; Thacker, H. D.; Bachim, B. L.; Gaylord, Thomas K.; Pikarsky, J.; Meindl, J. D.Item Optical transmission of polymer pillars for chip I/O optical interconnections(Georgia Institute of Technology, 2004-01) Bakir, Muhannad S.; Gaylord, Thomas K.; Ogunsola, O. O.; Glytsis, Elias N.; Meindl, J. D.Item Sea of Leads electrical-optical polymer pillar chip I/O interconnections for gigascale integration(Georgia Institute of Technology, 2003-12-01) Bakir, Muhannad S.Item Sea of polymer pillars: Compliant wafer-level electrical-optical chip I/O interconnections(Georgia Institute of Technology, 2003-11) Bakir, Muhannad S.; Gaylord, Thomas K.; Martin, Kevin P.; Meindl, James D.Item Chip-to-Module Interconnections Using "Sea of Leads" Technology(Georgia Institute of Technology, 2003-01) Kohl, Paul A.; Bakir, Muhannad S.; Gaylord, Thomas K.; Reed, Hollie A.; Mulé, Anthony V.; Jayachandran, Joseph Paul; Martin, Kevin P.; Meindl, James D.