My few words

just so story school chemistry.

We are here two thousand

and three my mom.

Yes yes we're here.

So you know the research
here which are scientists

research scientists all
over the room facilities.

Thanks Dr Brant given a chance.

So today I want to give you
talk just a chink in here.

So first I want to give you a reason that
while I have an idea to give the printing

of ability.

So in this May I was sent by my
boss to all Cornell to attend

a class action forum what about
it's within the in a in OK So

in that forum where we are given
thirty minutes to give

a short the print edition to introduce
to give an update an introduction for

our action capabilities and
when I when we prepared the slides and

said I have so many slide How can
I finish it within thirty minutes.

But when I got there I found while many
of the universe it doesn't have the.

Enough material to fill
the thirty minutes long.

They only have very few actually in truth.

So they try to talk about something hours
or even give us a story by the way or

keep talking talking talking talking will
probably take about thirty five minutes

to finish our of the whole thing.

So when I get come back I was thinking
because I was a clean room user

starting from two thousand one and
I don't realize I'm in such a facility

that had such a capability will
never fully explore in that thing.

So the user like me have
been working here for

over ten years to realize that
we have pressures for thirty.

So I want to give you a print ation
to let you know what we have and

let you to use our facilities
much most efficiently.

OK So today's Talk I'm going to color
some basic idea what is that showing and

telling about what is the.

What is awarded what ads and

give you an idea what is the part of
my ads how to evaluate your action.

OK so it's a good or is a back and
so what you want to.

How do you value it to successfully.

To your process and
then I'm going to introduce our many many.

Actually equipments so many of the
reactive card Ari the deep or I or I see.

And we have also a new very fancy thing

which can do some very fancy editing and
a lot.

I'm going to discuss some
common are processing problems.

So first.

What is actually there
is a very broad idea or

as can be defined just remove
material from some other substrate.

OK but is more than the I.C. fabrication
the action is very important for

create a pattern or transform a pattern
to the substrate that you need.

OK so in most cases the.

When you're working inside a clean
room you need to define a pattern

that is using the technique.

So leave the area that you don't
want to be blocked by the resist and

leave the area open then
introduce the action.

OK When the action the concert here
in remove the material the film.

OK And
finally you will remove the resist and

the pattern that you needed
is created a transfer.

OK so where you introduce the action.

There are two kind of
situation going to happen.

First is that isotropic adds.

So we'll talk about isotopic
actually that means it actually

that is uniformly all the direction.

So when the action comes through it.

I actually like this
way a vertical way or.

Horizontally or vertically.

OK the raid on both
directions about the similar.

There another situation out
there when introduce the action.

OK so
the only action in one direction the X.

rays on the other direction is very
small almost can be declared war so

that card and isotopic at so
in in the eyes of education.

This is more important because this is the
way we can you valley control the future

size zero can shrink shrink
the your device size and

finally make something
fancy like your C.P.U..

So how to make that actually happen so
have two ways.

OK we can do what X. or dry at what at the
end we have to do it inside a solution so.

Use a merge or
your substrate inside a container and

you fill out the actual solution.

You probably need to
control the temperature.

Maybe you need to control the.

The ph of the solution and
finally you remove that.

Your film material off your substrate.

And in the dry Usually that
happens in the chamber.

And the Chamber is substrate
a loaded on the plate and

you introduce the action most the time.

In the plot Mark sometimes
it can be gases.

And that class or gases will attack
your material on your substrate and

then forming a ball of tile product that
product can be brought away by the pump so

that action was happened like that way.

Of muscling mention forward
because where a doesn't have

any direction control so
most of cases where that is a topic.

In the triad.

That's why the design dryads you
want to control things to happen and

I saw the topic but there are exceptions.

One exception for
that is when you add in the solution.

The basic solution attack the silicon

the raid different crystal
phase are different.

So will use.

Like block the area in your submitted
silicon inside alkaline solution the long

the crystalline This is amazing angle is
exactly the fifty four points them for

that angle so you can create some
pattern like that pretty fencing.

So this is the spectrum for
where actually is.

We will cut it and isotopic some
most atomic heart a directional

because you can create
the specific angle like that.

For the Dryads sometime you can create
isotropic adds with a dry mass or

so this is an example a woman can
deliver release the fluoride So

there's this is the liver
the made by aluminum and

the bottom is silicon the silicon
has been removed by the fluoride so

it create a similar effect as you
submit the thing into the solution but

it's much cleaner than the X..

So talk about the advantages and
disadvantages about the way that.

So it's a simple.

So if you do.

Well probably what you
need is only a week or.

You don't need any other
very expensive equipment and

the highest throughput you can put money
away for together in the same process and

you can you can finish a lot of wafers and
the selectivity is very high in most

the time like the solution
is not attacking the mask or

most time the resist at all just
the material there you're trying.

But the disadvantage is isotopic edging So
we went the.

Action comes here that way so

that it's very hard to control
the dimension you trying to make.

And also a lot of cases.

The resist the photo that has an inherent
problems of the you solution gun

the gun attack the interface between
your reverse and your substrate and

create something like that but and
also the small feature if you're making

teeny tiny feature like a few micro
even a few hundred nanometers Hold on.

Add to things we need.

There's a problem.

The the action is not going to transfer
diffuse through that kind of feature

into the substrate so it's very hard
the actual rate is very very slow in that

situation and also the cast for
the chemicals are using

pretty high which time you have used
a lot of chemicals to make that happen.

Then you talk about dryads so dry.

You can create something like this where
frenzy you can imagine you can get

something like that with web ads.

So in the Dryads you don't have
the folder is a hidden problem because.

The part of our action coming from on top.

Doesn't attack the interface and

it can create an isotopic very and
isotopic patterns.

If you use a less chemical
because in the chamber.

You really pumped a very low vacuum so

they actually used chemical is very
limited and is suitable for the mation.

So you can.

In a foundry can set up
the automation of the processing very

very easily rather compared to
the where that but the disadvantage.

In is very complex equipment or
we call very expensive equipment.

Many of the quick maneuver by new
Are million dollars something like that.

OK and the selective it it can be poor.

So talk about the selector it is that is
where you have something over here for

protecting the mature they don't
want to be at the selectivity

the substrate and to resist.

It as they're the same way I like the way
it doesn't attack to resist at all in

the world had to resist.

So the selectee selectively
to compare to what

actually is very poor it
can create a residue.

On the way for and later on when
talking about the residue problem.

It can create a polymer because the gases
you're using the part where you're using

going to recombine and the forming some
kind of a polymer that's very difficult to

remove and also sometimes you've created
particle Asian formation just on your side

to resurface sometime created many
problems for later process so

that the territory that may
have been in the dry at.

So part of so in plastic This
typically using high pressure so

no are important parliament is using
a reactive ion actually caught our

eye is the most widely used action
mastered in the clean room.

OK so it typically has a lower pressure.

So you use iron bombardment So
basically it's a chemical and

physical act combined together
to increase the action that

this I won't be mastered
been mastered is the vast

measure that can sap free the neutral
spaces you create in the past.

Mark and aren't created in the past month.

So this separate is true.

So why.
Mastered only use the R.

and so accelerated to make
the physical bombardment and

the beer master that
doesn't want the on at all.

You just use the neutral species to make
it actually but I firmly like we don't

have the equipment used in this to
matter but we have to devise a quick

win because even that flood actually
will use the non-passage So in this.

We don't create any partner at
all is pure chemical adage.

So you use a foreign containing gases like
the number four I had wrong in Florida or

current fluoride to introduce to the
chamber and that gases will tax alike and.

Actually silicon away.

So my focus on talking about the past my
actions so in the previous page you'll

see all this mass of the related to
creation of a plasma so that's why I give

the over the past my aging you know we
have the fancy that they use the plasma.

But I think Main my focus was on platinum.

So you have to understand what
is possible there are two

terminology used to describe the past.

So first is the past.

Well so is actually is partially and I'd
guess containing equal number of positive

or negative charges as well as some
other number of non particles so

that's a mix of everything lot of a
neutral species like positive or negative.

Species missing together over a role.

It's a neutral.

But the glow discharge it
globally is a neutral but

it contains a region of Nad positive and
negative charge.

So.

So it circular two parts but
in some region it

had a more positive in some read in
the has more negative speeches but

when you actually when you used
the past my idea to make the actual or

the plasma and go discharge are awfully
like just interchangeable used.

So the term loan itself was
a tie user's work inside.

The plasma to refer to glow discharge.

So how does the promise form.

So first you have to evacuate the chamber
you don't want to leave any other species

inside the chamber so you interfere
in the formation of the past month so

chamber is going to future with the gases
you want to make the plasma and so

are after energy is applied
to a pair of electoral.

So at high the energy will accelerate
the electron inside the kinetic energy.

So then the electrons and cry.

With the new two are gas molecules
forms iron more electrons.

So after a while is going
to reach a steady state.

So at a steady state the analyzation
rate so that means the radio created

ions equals the recombination rate so
the ions of negative and

positive charge of the recombined
together to form in the neutral species.

So when that equilibrium has
reached the reach a steady state.

So the planet is charged a character
a central glow about reason and

dark sheets region near the lecturer's
of whatever you watch over

action to when it's running
you see some arm color and

bright color coming out of the we're
watching window and we of we usually use

that to make a judgment whether it is
hardware is working properly or not so.

So that's why it has
a name a glow this chart.

But you can see the power grid in
a semi neutral so the in that region.

This is a neutral the species
making together but she's read in

this mostly like all the potential
drives that happen in that region so

it acts for the accelerator
the past the part of the eye or

to bombard the substrate located on
electrodes so make that action happen.

So you can use these C. or microwave or
of power to create a plasma.

But in.

Or are most of the equipment we use over
here we use our to create the past month.

So that's that they're the reason for
that if we use D C.

It will leave charging in D.C.

current through the way for
a will do the damage to a way for

microwave plasma It doesn't
create the self D.C. bias.

So you need a D.C.
bias to create that bombardment.

So most While most widely used for
creating past mass R.F. current

through the way for them cause damage no
charge in damages part of the uniform.

There are one exception is if you actually
very deep charge it will come along

on the side wall and
causing some kind of damage.

And also it's easy to to introduce D.C.
bias into the system.

So when the part of the creed.

So this is the process
the how action will happen.

So first the gas is
introduced in the chamber so

those gases are all neutral gasses so
for C.H. have story.

Those thing are just to
create the flooring.

There and when the parts of
the power are power is applied.

So it could argue electron cloud with.

Neutral molecule and create our eye or
and free radical and asked.

And not another possibility.

It doesn't create any and
just create the free radicals.

Things like that.

So a part is a mix of everything because
there are many many possibilities could

could happen in the past month.

So if this is a combination
of many possibilities.

Then this reactive species like
the fluorine free radical will

react with silicon and create
the product this product is volatile.

So the ball of how product can be
removed by either the flow system or

the vacuum system and pumped out.

So the reaction can go have.

So this is a situation that happened
in our in the chamber of first

action gases coming inside the chamber and
then the dissociation the.

Molecule dissociated and then recover
nature of the electron without him.

To create the plaster my apartment
is created in the center area.

So reactive.

I am bombards of so the.

Positively charged iron are accelerated
by electrical field and

the subsidy surface is
with the kinetic energy.

So if there's no chemical
reaction that happened here.

It just bombard the surface and
remove the molecule that substrate.

Another possibility is absorption
of reactive ions on surface so.

So this is not a solid here like
flooring free radical is not charge so

it is diffuse onto our sample surface and
then this reactive species

are going to react with your
substrate molecule the work here and

the products actually in the bowl
of tiles all can be pumped out.

So there's a created.

Pattern this is actually chemical edging
so it doesn't have any direction so

it is on the other directions but
the physical

bombardment just happen on one direction
the vertical The two are substrate.

So this is like separate the two
you facts when the plasma action

happens actually there are two
facts a cat physical action and

chemical actually just happen this
vertical is an isotropic edge and

the chemical etching is happened between
the a free radicals known species.

And your substrate molecules so
it's is isotopic.

So how to control that components
good each every situation there is

a combination of a physical and
the chemical edge.

So one of the indication is the pressure
in pressure level in the chamber so

at a low price.

It is mostly physical sparring.

OK so it's unsuspected So
it is damaged in everything you resist and

you are our substrate direction Is it does
the radiation or our relation damages.

If you control this thing add
a middle range of the pressure level.

So is do physical and
chemical etching together.

OK.

It is directional because it has plenty of
the physical action involved and it's more

selective than spider and because
you have a more technical involved.

And in high pressure level.

So you have a less very less
difficult environment so

it is converted to chemical edging So
it is happening the situation.

Just like to face like
as the human diet for.

So this is a table that compare
with the situations that

when you do physical
chemical chemical actually.

Are not going to explain very
different specifically or

thing just one thing you want to

know is it has influence on the sidewalk
profile many of a situation people do

actually want to actually use their clean
ninety degree directly on to the bottom.

And in that situation.

You need to know you want and isotopic
actions you want to more of physical

component in your acting and also you
want the highest alike to Vittie So if

you have too much physical action in there
you have a poor selectivity So it's out.

It's a balance.

You have to balance between them.

So also the.

Critical dimension control is a problem.

And so there is no perfect recipe
can thirty five ever requirement.

You have to find a balance between among.

Them.

This is examples of like what
you can do with dry ash.

So you can look up size of a can I try it.

Aluminum ten M. constant chromium
Gollum that this is just a common

material that have been widely used inside
the Korean for to create their patterns

we provide the tons of gases
that then can satisfy your

your request were not limited to
that if you have a good idea and

we're very happy to certify you to
buy adding more gases more tactic.

OK So after understanding what the basic
knowledge of the chain then you

have to know how to judge whether
that how to evaluate a natural so

when I finished a recipe on my sample.

How do I know this is good or bad.

So those are the private areas you
need to know about your acting.

OK So first is that rate.

How fast does this thing at
is this the faster the better

I will say no because in
most situations too fast.

It means you lose control.

If you want to specifically
to a certain dabs

you actually want the the action read
to be a moderate level so you can.

Control that process well
you are selective media.

I explained before that.

This is actually a ratio
of actuate between two

materials in this example given here
this is not try this is outside so

after your putting the sample
into the chamber do the actually.

How much nitrate is to compare
with how much outside of

that you get a ratio over
here is selective U.T.

a lot of cases we're using the photo
of this over here as the mask and

either oxide or
nitride actually action rate of the film

comparable action rate of the reversed you
get a selective it it's a very important.

Primary to evaluate how good the recipe or
how good is is the equipment.

This is actually provides a normal
profile when after action you

break it look at it from the side view and

this is a common situation that you
will see if you even aware that

most probably will see that unless you're
doing the silicon our silicon match.

This is the isotopic
you can see in dry ads.

If you use in the flyer.

This is what are you going to see but most
while you know people want to at this and

isotopic directly very very
straight people want to do that but

the real situation.

Most probably you're going to see.

The action profile going
to tape in a little bit.

There are slide going to explain
why it's been like this way and

if you had a silicon trench is not
having something on top of a substrate

at deep through the silicon
trench in this and

more obvious like you have to transfer
tape way if you don't increase the power

during the agita going to finally
going to taper in action at all.

The undercut is also our
primary that we evaluate.

We don't want cut to be happened but
in the real situation.

It does happen.

Depends on what kind of technology.

You're using sun and

what recipe you're using this it could
be very very little or very serious.

So it's always like

to undercut the evaluation standard for
your action recipe and

uniformity is also a concern if
you're do a batch and many many

way first you want to hear very soon
the exactly the same so the uniformity

is very important because you do on like
this badge you come into uniform of the.

One percent and the other you come into
like ten percent and then no one's.

To buy a product that's also
a saying that you value.

This is the ration for increased and
that's a topic so even in the one

thing you need to understand if you're in
the as many things going to happen during

the action one of the things that you have
something will deposit on your side wall.

OK.
Sometimes it's not a bad thing that

you have something departed inside the war

in the later going to play in the Boss
process you deliberately deposit something

inside the world to protect your
side was so you can keep straight.

So this is a situation like.

If.

Situations you can have
the past the vision.

I can read the position of the product or
reaction of a product

with reactive neutrals or
deposition of components sourced gases so

all those three situations you can have
something depart on the sidewalk and

this actually protects your
side wall from being attacked.

So all the action in action will
come all the way to the bottom and

help you to create a very
straight profile Also if you have

passivation on the side war
is not going to attack.

This way so you have less undercut.

So.

As a last part of the basics.

You can understand what is the requirement
of a fast successful at so

you want high school activity.

In many situations I want to very very
small opening to very deep depths.

So.

If the selectivity is a poor you have to
put a very sick resists to protect your

substrate.

But if you do this sort of you know
very figure it's very hard to control

the dimensions to center the better.

So if you can find better action recipe.

You have higher selectivity then
you can use a very similar reserves

to control your critic to mention.

Fast actuates to achieve success.

If you have twenty waivers.

You don't want as you for
twenty days you want to done.

Everything in one day so that the good
trait is something that you need and

good sidewall profile control good
at uniformly across the way for

low device damage and
wide process latitude for

manufacturing something you created
here for the research prefers.

Finally delivered to the fundraiser for

the mass production then you
want something to be flexible.

Here's a list a lot of critical
promenaders related to the edging.

I don't have time to explain
in detail of everything but

later I have had some slot have a slide
like explain some of the primer.

This is all of the promises
you need to take consider

when you developing the recipe for
a project.

So it's.

So it's very tricky thing when
we're very glad to help you would

provide the best equipment
around America to

help you to do the project in the Walsall
provide the technical support.

We're very glad to help you
to to develop process and

with what do we just want from you
guys to come to use our facility.

Now come to the parts that
are what we have all here.

OK Like this picture very much.

So here we have one
dedicated part of a team

to support all of the part of my
equipment including deposition ching.

And we have to equipment engineers for
the service.

We have one process engineer that for
our protectee technical support.

We have students helping us do
all the character of visions.

And we have to clean rooms
one in padded building and

one is here in the Marcus building.

We have a nice place in it.

Not until I visit other cleaner and

to realize that we have such
a nice clean room or here.

We have.
Seventeen equipment for

doing all your action projects
we have six or seven nice piece.

We have three part of our Queen or
Azure four remove the resists and

polymers also have one friend see
the are isotopic rioters the floor.

I've heard.

And we have fourteen action gases.

We used to have one more like
flooring gases we remove that.

But we are happy if you request
to adding something more.

And we're happy to do that
substrate we can handle

dielectrics soliton compounds metals.

As long as you've you tell us what
kind of tree can happen over here and

we can handle all the substrate.

We're also have a lot of especially
special occasions I know many of the users

to create microflora changes are now
more popular people create a silicon

vs cart years more and more and
more popular these days and then.

I know other users are trying to
create and then the wires using our

actually equipment also like
people have like Jai or

meters or like Michael Neal those project
a very specific and very interesting.

I'm going to start it.

According to the category of equipment so
we have six are correct.

So first I'm going to give you what
is already so Ari is reactive.

So as I introduce before it is a
combination of a chemical in the physical

at so this process can include the R.

and bombardment and
the free radicals for chemical etching.

So this name is kind of misleading so

actually it should be called Assisted is
more accurate for you to understand but

this is like already been widely used or
we're just using that name for that.

So this is.

Has a relatively high and controllable
at rate are so the end isotopic.

The profile is acceptable as.

Compared with pretty good.

To selectively is pretty good.

So this is the reactor of the.

So you will see the electoral
this is a pair of electoral

are being used for
top why they are power to create a plasma.

So you're really in the chamber you put
your substrate on the powered electrode

caster and then or you create a possum
are usually something like a char

like our gram have been used to
increase to feed the core bombardment.

And you have in the past
where you create a flooring

are free radicals to do the chemical at.

So only one pair of electrode being
used in the later in life your family or

two pairs of electron have been are used.

This is a typical recipe for
four in our equipment.

So this is a recipe that for oxide.

So the gas you're using the C H R three
and some of the oxygen saw student is

used just to remove some kind of polymer
the created during the action process and

the power of using the two hundred fifty
watts and you use the radio frequency is

thirteen point five six made her third and
you use the chamber pressure for

the miller torso this is
a relatively low pressure.

It is suitable for the outside.

So as there are actual results.

So you need to mention what the software
you're actually because if you

actually mean the some
oxide in the dark side.

It's actually going to
be totally different.

As mask.

This is you have to mention the mask
because you can using a matter of

the mass so the selectivity
going to be very different.

Actually it is two hundred
fifty per minute and

uniformly across across a four inch
wafer would be like around two percent.

So this is a typical recipe and
the result four in our equipment.

Now it's starting from here to introduce
that will kind of equipment we

have over here.

This is a Palm storm are you one
of the oldest equipment in cycling

when I started from two thousand and one
or a cinder standing inside a courtroom.

So this can be used.

So we cannot side.

So we can I try the law
has to has two chambers.

So right chamber is configured.

The silicon oxide dielectrics and
polymer even as you eat and

B.C.B. are allowed in that chamber
a left chambre is that it cater for

those manholes and sort of five.

So if you see the gas in the hole cards
are different on the left chamber because

you need to know you have to use
the chlorine chemistry so you have a P.C.

Also re calling gas on the air and

on the right side since your action
silicon you have to use the flooring so

that it would concede a bunch of
flooring gases is used for this.

So this is very popular.

So it's pretty busy.

Then later in the two thousand and
seven we bought this visionary and.

Later we found is pretty good and
bought another one.

So now we have a true visionary is
one is in the clear on the other

one is here in the market.

So it can be used for actually
silicon oxide silicon nitride silicon

one we we separate those two mission
one is for CMOs compatible process.

The other one is for general four or
so in the sea most compatible vision

are a you're not allowed to
put in metal inside but the.

The other one.

You're OK to do everything.

So one.

Metal mask is allowed in the one the one
that I think in the padded building.

This has a six hundred watt So
it's very powerful machine and

he had as a six for effort so
if you see it as dedicated for

silicon and see for
a used widely for the art.

This is pretty new Oxford and point
are you one of the interesting things.

It has and the pointy tacked device
mounted it now it would take it off but

we're trying to fix and put it back.

This is interesting the wires that
it can detect when the action is

reached to interface so
when the material has been completed.

It will detect the point and will
automatically stop your action process.

So that's something that we tried
to our Make it happen here.

So it is also like you can do a lot
of a while and process it here.

You may only use for dielectrics but
you can also use for action selection.

Yeah.

So this is the chemistry
basically of the same.

This is you next is are you.

This is the latest Are you with body.

OK this is dedicated for shallow silicon.

So there are several groups requests
to do a very shallow silicon

action less than one micron and

in Florida based the chemistry of
the edging rate for silicon is very fast.

So it's very hard to control.

That's why in the previous I mention you
know or sometimes on actually too fast.

The one actually very slow.

So in this story we just
provide chlorine gas.

Chlorine chemistry to
use relatively slow and

we can control it to very
very shallow silicon.

So this isn't in markers building in
you can use the silicon nitride and.

Oxide and for photo resist the mask.

This is or are I from past master.

This must equipment is in padded
building is the dedicated for

Manal and the three fine material action.

So see we have.

Corey B.C.L. story.

Chlorine gas that we have our own oxygen
or an hydrogen or special just dedicated

for adding those materials and you can
use photos of this as the actual mask.

If you use B.C. but please do not
use as you age because this is

the only are you that has a loading lock
and we don't usually open the Chamar So

if you have contaminated inside is pretty
difficult to ought to clean inside.

And as you it is a special
polymer that has our.

Floor in the polymer inside is
very difficult to pump away

with the vacuum system.

But for the others.

I like aluminum chromium
those those metals

are very easy to be
actually in using this.

Ari.

OK.

Now we're finished with our
equipment now come to the I.C.P.

we talk while we talk to users inside
the Green We're always a I.C.P. but

actually the root cracker name should be
deep deep our I mean it's deep reactive.

So it's basically still the based on
the principle of the difference is

it use the I.C.P. inductively coupled
high density part of the plant source.

So it has to pair the actual one pair or
one pair of electro you just used to

create a high density plasma the other
pair of the election will be used to

create the actual field that drag the
positive eye in and support the substrate

so compared to regular are a much
much high density of a part.

So you can imagine it increased
the action read a lot.

And so in a highly and isotopic.

They used to create a deep
penetration in substrate.

So to cross.

There are two different
the master to create

a such a mess that one is
called The Boss process.

One is called cryogenic process.

The boss part as a much much more
popular than crowd journey process but

we also have that equipment that
do crowd joining in our clearing

process is a pattern the process
is created by a German company and

now it's almost dominant
in the deep are the world.

OK So
this is the it's this explain you what.

The process do so.

First it has to differ in the stage for
action.

One is called actually.

Step one is card passivation staff so
doing the actual step and.

The fluorine part

of the creative from says it's
going to come to the substrate and.

So you will see since like itself
Loren braised if we really call it

it will do some kind of a ladder
actually create a profile like that and

then the machine will stop
the supply of as our six.

And inject the Chembur
with C four F eight.

OK So we'll see four F.

and what does it do if you don't
create any irons inside the chamber.

You just create a uniform code
in every war on the system.

OK so it will code to side of war and
harm and bottom.

So then.

The machine will shut down the supply of
a C. for effort in starting provide the S.

have sex again and then during that.

So the physical bombardment will
help to remove the coding again

then introduce the floor and
free radicals to do another ad so

you'll see those patterns are going to
repeat again again again again until to

the end of your action so it can help
you to create a very straight profile so

this is an image as the image
that our boss process so

we call that scallop So
it's scallop card into a one cycle of the.

The two steps of.

So you'll see this is we're straight and
we're interested.

Very interesting pattern or all the brush
part part of the world like that.

So this is the typical recipe that you
will see on our process machine so

in the call you have or you introduce
two guesses as to have sex in an oxygen.

And during the deposition
cycle we use it for F eight.

So pardon power you need to.

You need to apply pattern
power when you do the call.

But during the deposition
cycle you don't need our and

coil power is the other paths
are parallel that creating the past not.

And you control the pressure in
two different cycles to create

the balance between passivation and
the edging and

you can also suffer the time you
don't want to reveal all the time.

Also work.

The back side of the substrate need be
cooled down just because such a high

density Harlan is very hard.

So if it too hard.

The process become too wild to control.

So to evaluate the process you have to

mention what kind of thing the reaction
you can actually pass process also

you can actually dielectrics and also what
kind of mask you're using and this is

actually a little bit different from
the thing we're talking about are you.

We're talking about like how many
answer on per minute here we can use

the cycles because.

That's is like you see the scale up but

you can convert it to our per minute
fairly easily and we also need to our.

The uniform of the artist the activity.

You see is ninety one point four
like you really will use our

polymer at the mask to actually
silicon then you can get if you do.

The process properly you can get
one hundred to one selective eighty

four Celica and compared to edging
oxide and the profile angle.

You want ninety degrees by the in
the reality in point five pretty good.

So this is a letter having impression
of what the Chamber look like so.

So two pair of them hard a generator
going to be used so one is the platen

power and
one is just dedicated to create the past.

Mark and the other pair is called pattern
these using to create the electrical field

and some of the devised they have the
electro magnetic field around the chamber

just to help to create a more straight.

And that's the way for
is on the bias to Chuck.

Some time we have
the electoral static charge.

And somehow mechanical Chuck.

So we have a different type of machine
to using different type of attack in.

So let's compare the with the normal.

Are you with the Bosch process.

OK so the Bosch process can be very
high actually is understandable

because you have a very high density
of plasma activity is very high.

Compared with normal high so

that's comparable as well as.

In the box process.

You have you need to cool from the back
side because the temperature on

the subject surface too high you need to
lower the temperature to protect your

mask and it has to and
that's a very good do.

In the park process but.

By the side the war is rough because you
create some time scallop the structure

of time in our A clean room too
small samples little bit tricky.

You have to mount it on a four inch
wafer because since you need to

cool the back side you can
either mounted on a plate.

You have to mount it on the carry away for
to do that but on the other side.

Easing.

Are you to need to prepare
anything with because if.

Located on a plate.

You can whatever size you
can sue into the chamber and

the side wall is pretty small
compared with the process.

OK.

Now this is our equipment for
doing the process.

So as to as I simply one of the oldest
equipment in the clear room.

It is our work or
as is almost like our twenty four

seven this like very busy equipment
in use or just like that.

So he has very well established
recipes for all different projects.

So that's one of the reason that people
want to stick to their old recipes and

using that.

So is dedicated for actual selection.

It can be so silicon or policy lickin.

There are more for silicon and
you can use a photo of this as math but

this is see more compatible talk so
that means no metal allowed and

also no as you allowed no B.C.B. alone.

This is S.T.S.

this is a virus a model of
the previous S.T.S. I.C.P. OK.

The difference is this
is has a huge power it

has five thousand one compared with
only have seldom one scholar power.

So it can do.

Very fast acting in this
model has the electro

magnetic field which helps to
give you more deep and also.

This is the model between the very
basic one and very advanced the one.

So there is a difference among those asked
here as machines to create different.

Profile also use as T.S.I.

superior you can create some kind
of aspect ratio compared with

opening you can add most creative
thirty to one aspect ratio trenches.

But with fears.

You can create something
between thirty to sixty.

Are aspect ratio doing this so we can.

Yes yes.

Pegasus is the most of the Western model
that's all to be solved from that company

and you can do very very fancy etching
you can do very teeny tiny open one

point five microns you can actually exert
the micro this is a conservative estimate

provided by the vendor there
is a record of using this

machine you can create a one hundred
to one aspect trenches using that.

So all of those three I.C.
pieces are dedicated for silicon and.

We have the same operation for
those three machines are very similar.

So if you are check off on one
of the I.C.P. S.T.S. I.C.P.

and your allowed to use the R.
get a simple use the other equipment.

This is from another vendor.

I see it has two chambers.

So there were the left chamber of
parts of my superiors very popular.

It's.

Before we are only I simply used for
action oxide.

So it's very very busy and the right
chamber is dedicated for actually silicon.

So this right chamber has been used to to

use the Bosch process and seal left
chamber in different gas supplies.

So basically the lead.

Chambre will out our most
you can do anything so

we don't fret over contamination just
because we have to do mechanical cleaning

every week or every two weeks.

So you're welcome to use OUR to try
our the sauce that you can imagine.

So those eyes apiece are you
going posh process and

I mentioned you can use cryo
journey process to do the similar.

So the basic principle about the crowd is
we're doing the adage you don't use it for

F.A.A. to pass away to your side war
in this case when you coud the whole

substrate so it can down to minus
one hundred ten degrees C. and

during the process you introduce our
decision in your gas and the oxygen.

Will our taxes on the sidewalk
to form passivation layer.

So to protecting the sidewalks So the same
thing when doing the actually deeper

deeper deeper decide
WHERE IS THE been passed away did so

you can create a relative a very
straight patterns using this matter.

So the when it is there is no palm oil
contamination because you don't introduce

any polymers and
you have a lower sidewall roughness this

side wall is very small as
compared with the process.

But the disadvantage
is pretty sensitive so

the temperature can has to be controlled
pretty well if the temperature too high.

There's no passivation form on
the sidewalk and the standard mask.

Usually we use for of this but under such
a low temperature the forest may crack

doesn't stand such extreme conditions.

Also because temperature too low.

So that usually the ball of how product
you created can be pumped away but

in the Such a cool cold temperature.

It may not last thing when argue just read
half of it on everywhere on on your fan.

So this isn't.

Our image that I took from our from one of

the Seas is from a student in
Caltech you can compare this side

was pretty very small as
compared to the process and

you can see the it is pretty straight also
compared with compared with the norm.

Ari is not as good as the park process but
it in many situation is very good for

if you want to create
someone up to electronics.

So you have to get a very small surface
this is technology that you can use.

So this is the crowd genic I.C.P.
we have in this market.

Clearly the power monsters
only has eight thousand watts.

So if you can.

So we allow you to after use like five or
six of them wants to or

to create a special project for yourself
and this also has tons of different gases.

So that it means you can do all
you can almost anything in there.

We will want to keep it dedicated for but

we're not limited to that
the only requirements.

You need to get our are approved
before you try something fancy.

So the temperature ranges from
minus one hundred fifty degrees C.

to three hundred degrees C.
So even if you're not using the crowd.

Janick process for action silicon for

other process you can
lower the temperature.

So to increase the selectivity because
the lower the temperature a yearly

physical actually used you make
your resists more more denser

harder to for the physical action so
you buy lower the temperature.

You can increase the selectivity
like from one point five to three or

four something like that.

This is another product from the S.T.S.

company because advanced oxide
actually called as is a dedicated.

Silicon oxide.

There's a special about that is that OK to
just because if you add a few Mindcrime

oxide is OK you can actually either a nice
if he or a normal Ira you tools but

if you want ads through a glass or
Coors or

pyro axe or fuse the silica then
it's very difficult because

this because of the chemical structure
of silicon dioxide it is very difficult.

And during the as if you actually deep you
create a lot of problem one of prominent

in the past.

Mark.

Become so hot to the surface become so

hot on all the polymers
will finally cured and

become so hard to remove that it
impossible for you to remove later so.

In this equipment we just
allow you to use the mantle.

You can for
actually shallow you may use for this but

we don't suggest you do that you have
to use the manual for the Corps in X..

So this is still used in the past
process but this is cool.

The two just dedicated forward for
glass actually.

OK so

this still is for dedicated for
three five material.

It also has tons of gases.

So this is the same thing if
you want play with country

your well come to discuss with us.

OK.

And also we have the dedicated to just for
action polymers so this is.

Oxygen in the chamber
helps remove the polymers

also remove the physical action and
positive action.

So we have a process cleaner.

We have Asher.

We have to ashers actually so
have you to do that.

And this is the last two on
the Introduce this is a fancy and

I saw the topic dry action to
have carded Zenon dye fluoride.

So this is the image that from you
release everything beneath the criminals

don't like structure over here so you
use are created by work or you use that.

You are.

OK So this is to promote here.

So last is normal processing
problems you will

see when you walk inside the courtroom.

One of the first first question for

new there is how to select
the proper equipment.

So I would suggest you like starting from
select the material if you want absolute

can dielectric you're going to
select different to depend on you.

How deep you want to actually be going
to select either our eye or I.C.P.

and depends on what kind of aspect
ratio of your project you design

the user can select them tells you one or
more the popular one.

Also the last thing you want is a two
wheel ability because some other tool is

extremely busy you want
to learn to use other to

turn a deal when the two is not available.

This is the table.

That is very helpful for you if you
want to modify a recipe not didn't stand

a recipe if you want to modify
something to create a good recipe for

your project you want to you want to know

what the primary change will effect
the final those parameters are.

If you want to modify it even
more change of gas ratio.

This is the reference that help you to
understand how you change the gas ratio

and well fact the edging
effect like acid in percent in

in the gas mixture was now
like always increase or

decrease the have the maximum value of for
the oxygen percent.

This is the actual data process of how
you will factor and that's the topic.

So if you pass a bit too much and

then you create a taping like that but
if a selector popper.

Ratio you can get deeper edging
much straighter profile.

That is telling you big opening and
a small painting will create

will have different actuator finally
you have a different pattern but

you have a different steps
are you doing the actual.

You will have a contamination and

damage problem your temper
is is pretty complicated.

So it's very important to you

when you finish the product
actions that the next step.

Those damage will greatly affect so
you need to consider those facts.

Polymer residue creation is annoying
problem for all the action process.

So this is slower help you like how to
remove that and how to avoid that thing.

OK Finally last page all
saying are clear and for

the support for all the staff members for
support all the work and

if you are interesting in doing
the doing the action work.

You're welcome to visit our website for
more information about equipment and

processing and
you're welcome you to join our clean room.

Thank you very much sort
of article the time Russian

question of.

Using a D.C. equipment to write so

for etching carbon based the material
you just use the oxygen in Argyll so

almost all the equipment can do that.

Excuse me.

While it depends on what you want
to do because the nonprofit matter.

Are you understand is isotopic and

a very selective we're only at Silicon
is not designed as anything else.

So it doesn't add polymer it doesn't
add oxide it doesn't add metal.

It's just absolute.

So in in in the are I no more are you
to the plate or ground there.

So if your if your substrate a pound
is well ground it is should not

have that problem but
if you have an insulator and

is not grounded in well you may have
to charge a trapped during the process.

So that's the design of that's
a desirable process you don't want

the tar to be trapped in your device and
finally kill device.

So anyway if it inside the Plaza
you have a lot of hardened species.

So you may have a chance to be trapped.

So depends on how the design stuff
you want either you want your

sample to well grounded or you have
some way to get rid of the charges or

use non charge like what it can
see you don't have hard problems.

Yet you has deceived by and

said Yeah but the D.C. bias is not with
flight it is something created by the it's

self self created purpose.

Right.

I think we can.

And do that but
I don't think very do know that

I what.